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ULTRASONIC SOLDERING, NO NEED OF FLUX.
For soldering to ceramic, aluminum, circuit boards, non metals

Ultrasonic soldering is mainly used for “flux-less soldering” or “fulx free” to non metals such as glass, ceramic, and to such difficult-to-solder metals as aluminum and stainless steel. Nowaday, environmental concerns have been seen in global societies and manufacturing industries as represented by RoHS and other regulations. Ultrasonic soldering help manufacturers to reduce or eliminate the use of halogen material, which is the main chemical of flux.
Ultrasonic soldering bonding method

ULTRASONIC SOLDERING SYSTEM (standard configuration)

Controlling ultrasonic generation and temperature

  • Ultrasonic unit features

    • ・Built-in temp. and ultrasonic controller
    • ・150W high power heater
    • ・Automatically managing frequency
    • ・Stable ultrasonic vibration
    • ・Various iron tips
  • Soldering on a solar panel

    Soldering on a solar panel

  • Aluminum material soldering (x1000)

    Aluminum material soldering (x1000)

  • Ultrasonic controller

    Ultrasonic controller

  • Ultrasonic soldering head

    Ultrasonic soldering head

  • Exclusive soldering iron tips

    Exclusive soldering iron tips

Ultrasonic soldering mechanism

Soldering up to now was basically fusing the solder (tin) to the base metal. Ultrasonic soldering technology is paving the way for a new era where tin can be fused with non-metals, such as glass or ceramics. Although the same ultrasonic is used, the joining principles are different for fusing to metals and non-metals.

Ultrasonic method

REFERENCE VIDEOS

FOR ROBOTICS

*The following items are also required for ultrasonic soldering.

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