ULTRASONIC SOLDERING, NO NEED OF FLUX.
For soldering to ceramic, aluminum, circuit boards, non metals
Ultrasonic soldering is mainly used for “flux-less soldering” or “fulx free” to non metals such as glass, ceramic, and to such difficult-to-solder metals as aluminum and stainless steel. Nowaday, environmental concerns have been seen in global societies and manufacturing industries as represented by RoHS and other regulations. Ultrasonic soldering help manufacturers to reduce or eliminate the use of halogen material, which is the main chemical of flux.
Ultrasonic soldering bonding method
ULTRASONIC SOLDERING SYSTEM (standard configuration)
Controlling ultrasonic generation and temperature
Ultrasonic unit features
- ・Built-in temp. and ultrasonic controller
- ・150W high power heater
- ・Automatically managing frequency
- ・Stable ultrasonic vibration
- ・Various iron tips
Soldering on a solar panel
Aluminum material soldering (x1000)
Ultrasonic soldering head
Exclusive soldering iron tips
Ultrasonic soldering mechanism
Soldering up to now was basically fusing the solder (tin) to the base metal. Ultrasonic soldering technology is paving the way for a new era where tin can be fused with non-metals, such as glass or ceramics. Although the same ultrasonic is used, the joining principles are different for fusing to metals and non-metals.
Ultrasonic soldering to glass without flux
This video shows soldering to a glass plate using an ultrasonic unit without flux
The case of ultrasonic soldering to a thin-film solar panel
It shows soldering to a solar panel as the function of electrodes.