Laser Soldering

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Laser Soldering Solutions for Precision and Productivity

As electronic circuit boards become thinner and components more complex and multilayered, technology is advancing so rapidly that traditional soldering methods can no longer keep up. Laser soldering enables precise soldering in ultra-fine areas that are difficult or impossible to reach with conventional soldering irons. We have extensive experience working with both solder paste and wire solder.

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JAPAN UNIX Laser Systems

Advancing quality and innovation.
Laser soldering enables not only advanced soldering, but also innovations in process control and quality management. Japan Unix’s unique laser soldering system integrates a high-performance laser soldering unit, precise temperature control, and powerful management software—delivering a complete solution for modern production.

What is the difference between a “surface heat generation” and “thermal conduction”?

In soldering, tip soldering is basically a 3 step process that encompasses pre-heating of soldering points, applying heat to supply the solder, and then post-heating to shape the solder and finish it. This workflow is the same whether using iron tip soldering or laser soldering, but the method of applying heat to supply the solder differs, and this is very important to understand.

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ULD-02 Laser Soldering Unit for a New Era of Connected, Visualized Soldering

Now that laser soldering has been established as one of the post-processing methods, the new laser soldering unit has been developed to achieve a higher level of process control than simple soldering. In particular, traceability and temperature measurement and control functions have been improved.

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Advanced Process Control with Thermo Pro™ and Soldering Manager

In addition to conventional laser soldering control elements (power, time, etc.), the Thermo Pro™ temperature control function enables temperature management and control during soldering. In addition, when used in conjunction with the Soldering Manager Pro soldering management software, it is possible to monitor each soldering condition in real time and store the data on a PC. A video storage function using a coaxial camera can also be installed, allowing improved production control even from a distance.

Optimized laser shape improves soldering efficiency!
Supports both SMT and rework

Optimized laser shape for highly efficient heat delivery. Supports not only perfect circles, but also ellipses, squares, rings, and other irregular shapes. Multi-φ function changes the laser spot size without changing the Z-axis (working distance). Optimization of laser geometry is possible even with different pad sizes. Area Laser is not limited to conventional post-process soldering, but also supports SMT as a local reflow process, and is compatible with Thermo Pro™ and Soldering Manager Pro, allowing visualization of the reflow process.

Equipped with external editing function

Data link communication allows external editing of conditions. Enables consistent interface design and easy condition editing even in highly integrated facilities.