{"id":16896,"date":"2023-08-24T16:08:34","date_gmt":"2023-08-24T07:08:34","guid":{"rendered":"https:\/\/www.japanunix.com\/en\/?post_type=column&#038;p=16896"},"modified":"2024-01-09T17:35:20","modified_gmt":"2024-01-09T08:35:20","slug":"youtube-tech-article-what-causes-solder-balls-explanation-of-causes-and-countermeasures-by-soldering-robot","status":"publish","type":"column","link":"https:\/\/www.japanunix.com\/en\/column\/causes_of_solder_balls\/","title":{"rendered":"What causes solder balls? Explanation of Causes and Countermeasures by Soldering Robot [YouTube Tech Article]"},"content":{"rendered":"<div class=\"c-box\">\n<div class=\"row\">\n<div class=\"col-md-12\">\n<div class=\"heading-title-image\">\n<div class=\"_utility-wrapper\">\n<div class=\"_date\">Aug 25th, 2023<\/div>\n<div class=\"_category\">YOUTUBE Tech Article<\/div>\n<\/p><\/div>\n<div class=\"_image-wrapper\">\n<div class=\"_image\"><img decoding=\"async\" src=\"\/wp\/wp-content\/uploads\/2022\/11\/japanunix_youtube.jpg\" alt=\"\" \/>\n\t\t\t\t\t<\/div>\n<div class=\"_text\">\n<p class=\"_title\">YOUTUBE Tech Article<br \/>What causes solder balls? Explaining the causes and countermeasures with soldering robots<\/p>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<div class=\"col-md-12\">\n<h3>Table of Contents<\/h3>\n<ul class=\"list-contents\">\n<li><a href=\"#01\">Theme<\/a><\/li>\n<li><a href=\"#02\">Factor 1: During Contact<\/a><\/li>\n<li><a href=\"#03\">Factor 2: While feeding Solder<\/a><\/li>\n<li><a href=\"#04\">Factor 3: Moisture in the PCB<\/a><\/li>\n<li><a href=\"#05\">Summary<\/a><\/li>\n<li><a href=\"#06\">Related Products &#038; Services<\/a><\/li>\n<li><a href=\"#07\">Watch this article&#8217;s video here<\/a><\/li>\n<\/ul>\n<div class=\"panel-light\">\n<div class=\"_header\">Document Download<\/div>\n<div class=\"_body\"><mark>\uff3cIntroduced by over 1,000 companies worldwide\uff0f<\/mark> Introduction material for JapanUnix products and services<\/p>\n<div class=\"row-lg-2\">\n<div class=\"col\"><a class=\"btn-primary btn-animation btn-block btn-icon-next\" href=\"https:\/\/www.japanunix.com\/en\/contact\/download_catalog\">Download Now<\/a><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/div>\n<hr class=\"hr-color-dark\">\n<div id=\"00\" class=\"c-box\">\n<div class=\"row\">\n<div class=\"col-md-5\">\n<p>\n\t\t\t\t<a class=\"btn-primary btn-icon-next\" href=\"https:\/\/www.japanunix.com\/en\/products\/automation\/\">Click here for Automated Soldering Robots<\/a>\n\t\t\t<\/p>\n<\/p><\/div>\n<div class=\"col-md-7\">\n<div class=\"js-modal-video\" data-modal=\"#modal-media-target\" data-video-id=\"8Qa5BXTiXlc\">\n<div class=\"_thumb\"><img decoding=\"async\" src=\"https:\/\/img.youtube.com\/vi\/8Qa5BXTiXlc\/maxresdefault.jpg\" alt=\"\" \/><\/div>\n<\/p><\/div>\n<h5>Watch this article&#8217;s video here<\/h5>\n<\/p><\/div>\n<\/p><\/div>\n<p>\t<!-- ------------------Theme starts here------------------- --><\/p>\n<div id=\"01\" class=\"c-box\">\n<div class=\"row\">\n<div class=\"col-md-12\">\n<h2 class=\"heading-title\">Theme<\/h2>\n<\/p><\/div>\n<\/p><\/div>\n<div class=\"row\">\n<div class=\"col-md-7 order-md-2\">\n<p><span class=\"text-size-small\"><span class=\"label-primary\">U<\/span>&emsp;Hello everyone. Supporting your soldering life, I&#8217;m Unokuchi.<br \/>\n<br \/>\nToday, I&#8217;d like to talk about a soldering defect that we get a lot of inquiries about, which is <span class=\"text-size-medium\"><strong><mark>solder balls<\/mark><\/strong><\/span>. There are different reasons and ways solder balls occur. Today, we won&#8217;t discuss the method of heating the entire object but focus on the <span class=\"text-size-medium\"><strong><mark>selective heating<\/mark><\/strong><\/span> method that JapanUnix frequently uses.<br \/>\n<br \/>\nThere are several causes for the occurrence of solder balls, but today I&#8217;d like to mention <span class=\"text-size-medium\"><strong><mark>the three most common causes<\/mark><\/strong><\/span> I often hear about.<br \/>\n\t\t\t\t<\/span><\/p>\n<\/p><\/div>\n<div class=\"col-md-5 order-md-1\">\n<div class=\"_image align-center mb-4\"><img decoding=\"async\" src=\"\/en\/wp\/wp-content\/uploads\/2023\/07\/causes_of_solder_balls_en_1.jpg\" \/><\/div>\n<div class=\"_image align-center mb-4\"><img decoding=\"async\" src=\"\/en\/wp\/wp-content\/uploads\/2023\/07\/causes_of_solder_balls_en_2.jpg\" \/><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<p>\t<!-- ------------------Cause 1: During Contact starts here------------------- --><\/p>\n<div id=\"02\" class=\"c-box\">\n<div class=\"row\">\n<div class=\"col-md-12\">\n<h2 class=\"heading-title\">Factor 1: During Contact<\/h2>\n<\/p><\/div>\n<div class=\"col-md-7 order-md-1\">\n<p><span class=\"text-size-small\"><span class=\"label-primary\">U<\/span>&emsp;The first cause of solder balls is <span class=\"text-size-medium\"><strong><mark>during contact<\/mark><\/strong><\/span>. They occur when the heating element contacts the object and when it detaches. Why does this happen? Solder balls are attached to the heating source and <span class=\"text-size-medium\"><strong><mark>drop off upon contact<\/mark><\/strong><\/span>. This is one of the main reasons.<br \/>\n<br \/>\nAlso, the solder already present on the heating element, this solder <span class=\"text-size-medium\"><strong><mark>detaches<\/mark><\/strong><\/span> when separated.<br \/>\n<br \/>\nIn this way, they occur due to contact. This is one of the major causes.<br \/>\n\t\t\t\t<\/span><\/p>\n<\/p><\/div>\n<div class=\"col-md-5 order-md-2\">\n<div class=\"_image align-center mb-4\"><img decoding=\"async\" src=\"\/en\/wp\/wp-content\/uploads\/2023\/07\/causes_of_solder_balls_en_3.jpg\" \/><\/div>\n<div class=\"_image align-center mb-4\"><img decoding=\"async\" src=\"\/en\/wp\/wp-content\/uploads\/2023\/07\/causes_of_solder_balls_en_4.jpg\" \/><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<hr class=\"hr-color-dark\">\n<div class=\"row\">\n<div class=\"col-md-7 order-md-2\">\n<p><span class=\"text-size-small\"><span class=\"label-primary\">U<\/span>&emsp;To mitigate this issue, make sure there are no extra materials attached during contact, so it&#8217;s crucial to clean thoroughly and manage the objects in a <span class=\"text-size-medium\"><strong><mark>temperature-controlled environment<\/mark><\/strong><\/span>. Another method is to reduce the time of contact, ensuring it&#8217;s only enough to transfer the necessary amount of heat. This can help in reducing the occurrence of solder balls.<br \/>\n\t\t\t\t<\/span><\/p>\n<\/p><\/div>\n<div class=\"col-md-5 order-md-1\">\n<div class=\"_image align-center mb-4\"><img decoding=\"async\" src=\"\/en\/wp\/wp-content\/uploads\/2023\/07\/causes_of_solder_balls_en_5.jpg\" \/><\/div>\n<div class=\"_image align-center mb-4\"><img decoding=\"async\" src=\"\/en\/wp\/wp-content\/uploads\/2023\/07\/causes_of_solder_balls_en_6.jpg\" \/><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/div>\n<hr class=\"hr-color-dark\">\n<p><!-- ------------------Starting from factor 2, when feeding solder-------------------<span class=\"text-size-medium\"><strong><mark>aaa<\/mark><\/strong><\/span> --><\/p>\n<div id=\"03\" class=\"c-box\">\n<div class=\"row\">\n<div class=\"col-md-12\">\n<h2 class=\"heading-title\">Factor 2: when feeding solder<\/h2>\n<\/p><\/div>\n<div class=\"col-md-7 order-md-1\">\n<p><span class=\"text-size-small\"><span class=\"label-primary\">U<\/span>&emsp;Next, the cause of solder ball formation, factor 2.<br \/>\n<span class=\"text-size-medium\"><strong><mark>When solder is fed,<\/mark><\/strong><\/span> it occurs at that timing. Especially, it occurs when the speed of solder feeding is either <span class=\"text-size-medium\"><strong><mark>too fast or too slow,<\/mark><\/strong><\/span> due to the flux contained in the wire solder.<br \/>\n<br \/>\nIn the case of it being too fast, the <span class=\"text-size-medium\"><strong><mark>flux vaporizes<\/mark><\/strong><\/span> due to a rapid temperature rise and adheres to the surroundings in a popping manner. If it&#8217;s too slow, the solder is overheated, causing the flux inside to vaporize and pop.<br \/>\n<br \/>\nThis can be caused by the flux contained in the solder during feeding.<br \/>\n\t\t\t\t<\/span>\n\t\t\t<\/p>\n<\/p><\/div>\n<div class=\"col-md-5 order-md-2\">\n<div class=\"_image align-center mb-4\"><img decoding=\"async\" src=\"\/en\/wp\/wp-content\/uploads\/2023\/07\/causes_of_solder_balls_en_7.jpg\" \/><\/div>\n<div class=\"_image align-center mb-4\"><img decoding=\"async\" src=\"\/en\/wp\/wp-content\/uploads\/2023\/07\/causes_of_solder_balls_en_8.jpg\" \/><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<hr class=\"hr-color-dark\">\n<div class=\"row\">\n<div class=\"col-md-7 order-md-2\">\n<p><span class=\"text-size-small\"><span class=\"label-primary\">U<\/span>&emsp;For this situation, the countermeasure is to adjust the speed of solder feeding to an <span class=\"text-size-medium\"><strong><mark>appropriate speed<\/mark><\/strong><\/span>. There&#8217;s a just-right speed, so discern it.<br \/>\n<br \/>\nAlso, by <span class=\"text-size-medium\"><strong><mark>making notches in the solder itself<\/mark><\/strong><\/span>, it&#8217;s harder for the internal flux to vaporize. Please consider these countermeasures.<br \/>\n\t\t\t\t<\/span>\n\t\t\t<\/p>\n<\/p><\/div>\n<div class=\"col-md-5 order-md-1\">\n<div class=\"_image align-center mb-4\"><img decoding=\"async\" src=\"\/en\/wp\/wp-content\/uploads\/2023\/07\/causes_of_solder_balls_en_9.jpg\" \/><\/div>\n<div class=\"_image align-center mb-4\"><img decoding=\"async\" src=\"\/en\/wp\/wp-content\/uploads\/2023\/07\/causes_of_solder_balls_en_10.jpg\" \/><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/div>\n<p><!-- ------------------Starting from factor 3, moisture inside the board-------------------<span class=\"text-size-medium\"><strong><mark>aaa<\/mark><\/strong><\/span> --><\/p>\n<div id=\"04\" class=\"c-box\">\n<div class=\"row\">\n<div class=\"col-md-12\">\n<h2 class=\"heading-title\">Factor 3: moisture inside the board<\/h2>\n<\/p><\/div>\n<div class=\"col-md-7 order-md-1\">\n<p><span class=\"text-size-small\"><span class=\"label-primary\">U<\/span>&emsp;Lastly, the cause of solder ball formation, factor 3.<br \/>\n<span class=\"text-size-medium\"><strong><mark>Moisture trapped inside the board.<\/mark><\/strong><\/span> This is a cause. We sometimes refer to it as <span class=\"text-size-medium\"><strong><mark>humidity<\/mark><\/strong><\/span>, but the moisture inside the board tries to escape when heated.<br \/>\n<br \/>\nAnd when trying to escape, it pops out.<br \/>\n\t\t\t\t<\/span>\n\t\t\t<\/p>\n<\/p><\/div>\n<div class=\"col-md-5 order-md-2\">\n<div class=\"_image align-center mb-4\"><img decoding=\"async\" src=\"\/en\/wp\/wp-content\/uploads\/2023\/07\/causes_of_solder_balls_en_11.jpg\" \/><\/div>\n<div class=\"_image align-center mb-4\"><img decoding=\"async\" src=\"\/en\/wp\/wp-content\/uploads\/2023\/07\/causes_of_solder_balls_en_12.jpg\" \/><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<hr class=\"hr-color-dark\">\n<div class=\"row\">\n<div class=\"col-md-7 order-md-2\">\n<p><span class=\"text-size-small\"><span class=\"label-primary\">U<\/span>&emsp;As for the countermeasures, it&#8217;s not about the heating tools but more about <span class=\"text-size-medium\"><strong><mark>condition management<\/mark><\/strong><\/span> of the board or components.<br \/>\n<br \/>\nFor instance, <span class=\"text-size-medium\"><strong><mark>seasonality<\/mark><\/strong><\/span>, like the rainy season in June, can make boards more humid. Therefore, it&#8217;s crucial to dry them properly and solder in that condition.<br \/>\n\t\t\t\t<\/span>\n\t\t\t<\/p>\n<\/p><\/div>\n<div class=\"col-md-5 order-md-1\">\n<div class=\"_image align-center mb-4\"><img decoding=\"async\" src=\"\/en\/wp\/wp-content\/uploads\/2023\/07\/causes_of_solder_balls_en_13.jpg\" \/><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/div>\n<p><!-- ------------------Starting from the conclusion-------------------<span class=\"text-size-medium\"><strong><mark>aaa<\/mark><\/strong><\/span> --><\/p>\n<div id=\"05\" class=\"c-box\">\n<div class=\"row\">\n<div class=\"col-md-12\">\n<h2 class=\"heading-title\">Conclusion<\/h2>\n<\/p><\/div>\n<div class=\"col-md-7 order-md-1\">\n<p><span class=\"text-size-small\"><span class=\"label-primary\">U<\/span>&emsp;In summary, there are various factors that can cause solder ball formation. It&#8217;s crucial to grasp the cause properly and take countermeasures.<br \/>\n<br \/>\nSoldering is not just about the solder and the tool, but also about the surrounding conditions. Always be mindful of them.<br \/>\n\t\t\t\t<\/span>\n\t\t\t<\/p>\n<\/p><\/div>\n<div class=\"col-md-5 order-md-2\">\n<div class=\"_image align-center mb-4\"><img decoding=\"async\" src=\"\/en\/wp\/wp-content\/uploads\/2023\/07\/causes_of_solder_balls_en_14.jpg\" \/><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/div>\n<div class=\"row\">\n<div class=\"col-md-12\">\n<div class=\"panel-light\">\n<div class=\"_header\">Document Download<\/div>\n<div class=\"_body\"><mark>\uff3cImplemented in over 1,000 companies both domestically and internationally\uff0f<\/mark>Introduction materials for Japan Unix&#8217;s products and services<\/p>\n<div class=\"row-lg-2\">\n<div class=\"col\"><a class=\"btn-primary btn-animation btn-block btn-icon-next\" href=\"https:\/\/www.japanunix.com\/en\/contact\/download_catalog\">Download Now<\/a><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<p><!-- ------------------Related Products & Services starts here-------------------<span class=\"text-size-medium\"><strong><mark>\u3042\u3042\u3042<\/mark><\/strong><\/span> --><\/p>\n<div id=\"06\" class=\"c-box\">\n<div class=\"row\">\n<div class=\"col-md-12\">\n<h2 class=\"heading-title\">Related Products &#038; Services<\/h2>\n<\/p><\/div>\n<\/p><\/div>\n<div class=\"c-box\">\n<div class=\"row\">\n<div class=\"col-md-12\">\n<p>\n\t\t\t\t\t<a class=\"btn-primary btn-icon-next\" href=\"https:\/\/www.japanunix.com\/en\/products\/automation\/\">For automated soldering robots click here<\/a>\n\t\t\t\t<\/p>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/div>\n<p><!-- ------------------Video of the Column starts here-------------------<span class=\"text-size-medium\"><strong><mark>\u3042\u3042\u3042<\/mark><\/strong><\/span> --><\/p>\n<div id=\"07\" class=\"c-box\">\n<div class=\"row\">\n<div class=\"col-md-12\">\n<h2 class=\"heading-title\">The video for this article is here<\/h2>\n<\/p><\/div>\n<div class=\"col-md-3\">\n<div class=\"js-modal-video\" data-modal=\"#modal-media-target\" data-video-id=\"8Qa5BXTiXlc\">\n<div class=\"_thumb\"><img decoding=\"async\" src=\"https:\/\/img.youtube.com\/vi\/8Qa5BXTiXlc\/maxresdefault.jpg\" alt=\"\" \/><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/div>\n","protected":false},"featured_media":0,"template":"","column_category":[296,307],"column_tag":[],"acf":[],"aioseo_notices":[],"_links":{"self":[{"href":"https:\/\/www.japanunix.com\/en\/wp-json\/wp\/v2\/column\/16896"}],"collection":[{"href":"https:\/\/www.japanunix.com\/en\/wp-json\/wp\/v2\/column"}],"about":[{"href":"https:\/\/www.japanunix.com\/en\/wp-json\/wp\/v2\/types\/column"}],"wp:attachment":[{"href":"https:\/\/www.japanunix.com\/en\/wp-json\/wp\/v2\/media?parent=16896"}],"wp:term":[{"taxonomy":"column_category","embeddable":true,"href":"https:\/\/www.japanunix.com\/en\/wp-json\/wp\/v2\/column_category?post=16896"},{"taxonomy":"column_tag","embeddable":true,"href":"https:\/\/www.japanunix.com\/en\/wp-json\/wp\/v2\/column_tag?post=16896"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}